Hi, I am new here and have read most of hokes book. I have also watched a number of Steves' videos. I have used AuCl to dissolve gold and really like it. It is precipating now and I am going to try and get to decanting it this next week. My source for gold is silicon wafers. I use HF to remove the polyimide coating which exposes the gold, followed by the gold lifting off the underlying films, which HF attacks.
I used AR from Shorr which I feel is a waste. Takes too long. I used their nitric replacement sub-zero. I have had components soaling in solution for days, the gold finally removes but it takes considerable time. I would not recommend this solution to anyone.
I could probably just rinse the gold runners and melt, but to ensure a higher purity I dissolved it in HCl-Clorox and precipitated with Bodine which is Sodium Pyrosulfite. I have dark gold flakes still floating on the solution, which I will right now assume is gold. I will test after I decant.
I want to try Acid Peroxide now. From Steves' video it looked like a 2:1 ratio HCl:H2O2, correct?
Also I have 30% unstabilized H2O2, anyone have an idea what the ratio would translate to?
Also I want to try dropping a whole wafer into HCL-Clorox. I have seen and heard that HCl reacts violently with Al, which is a typical metal underlayment, along with copper. My question is does anyone have experience with this? I saw a video that used Al cubes in HCl with no reaction.
Thanks, 1dizzy1
I used AR from Shorr which I feel is a waste. Takes too long. I used their nitric replacement sub-zero. I have had components soaling in solution for days, the gold finally removes but it takes considerable time. I would not recommend this solution to anyone.
I could probably just rinse the gold runners and melt, but to ensure a higher purity I dissolved it in HCl-Clorox and precipitated with Bodine which is Sodium Pyrosulfite. I have dark gold flakes still floating on the solution, which I will right now assume is gold. I will test after I decant.
I want to try Acid Peroxide now. From Steves' video it looked like a 2:1 ratio HCl:H2O2, correct?
Also I have 30% unstabilized H2O2, anyone have an idea what the ratio would translate to?
Also I want to try dropping a whole wafer into HCL-Clorox. I have seen and heard that HCl reacts violently with Al, which is a typical metal underlayment, along with copper. My question is does anyone have experience with this? I saw a video that used Al cubes in HCl with no reaction.
Thanks, 1dizzy1