drlonzo
New member
Good evening everyone. I'm finally getting to start my first batch of AP up on some ram edges and card edges. What i'd like to have some help figuring out is about how long it will take for the AP to disolve off the underlying copper/nickle to allow the gold foils to release. Using the following scenario.
I have about 9 ounces of plated edges from both cards and ram.
There will be no heat applied - reliing on ambient air temp.
No bubbler/air pump being used.
Any help would be greatly appreciated.
Thomas
I have about 9 ounces of plated edges from both cards and ram.
There will be no heat applied - reliing on ambient air temp.
No bubbler/air pump being used.
Any help would be greatly appreciated.
Thomas