Thanks, Butcher and Geo------------I went and read the entire thread on this guy and his device. The Butler design
seems to be the real deal.
Even though the concept of being able to run the Ar process indoors was very tempting, and the design seemed pretty clever, I
could see no failsafes, and, luckily, held off until I could get professional opinions from the forum.
I'm still working on typesetting Hoke's book in Adobe InDesign so that I can print it out with 12-14 point type,
and have all the paragraphs and line spacing correct, to make it easier for me to read, so I haven't had the
pleasure (yet) of working my way through that book. I've got some bookbinding equipment, so I'll probably bind
it into 2 sections, because with the larger type, it's over 400 pages.
Thus, caution is the word of the day here, every day, with the only thing I've done so far being finger foils
with Ferric Chloride, and that's working really well.
Next up, motherboard pins, both the fully plated ones and the partially plated (ISA, PCI, Ram) slot pins.
Based on the reading I've done on the forum so far, if I've understood things correctly, I have 2 choices of
processes for the pins:
1. HCl to dissolve the Tin/Berrylium
2. Sulphuric Cell to deplate the pins [a note: all the pins I've harvested so far have been tin----I have yet to
come across any copper-cored pins].
*3. I've been told that smelting/fluxing the pins will not work.
Everything I've seen on the forum has shown Sn to be a major headache to the refining end of things, so I want to get it
out of the material stream, a.s.a.p.
Am I on the right track, to process the pins safely?
thanks again,
Mike