I have contructed a cell for deplating and would like to ask a few questions. I have seen most people build the lead so it sits in the solution with just one piece coming out to connect the negative terminal. Am i ok with what i have done with the two coming out of solution to add extra support?? The copper mesh basket is slightly raised but i have done this on purpose so when items are added for deplating it goes vertical through the weight. Also am i ok with 98% Sulphuric or should it be watered down?
Can anyone see any problems that i might run into, i want to be safe.
Thanks for any help.![Smile :) :)](data:image/gif;base64,R0lGODlhAQABAIAAAAAAAP///yH5BAEAAAAALAAAAAABAAEAAAIBRAA7)
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Can anyone see any problems that i might run into, i want to be safe.
Thanks for any help.
![IMG_0822.JPG IMG_0822.JPG](https://cdn.imagearchive.com/goldrefiningforum/data/attachments/14/14070-4a71ff04324dc1c2a5f18e09b5319624.jpg)
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![IMG_0824.JPG IMG_0824.JPG](https://cdn.imagearchive.com/goldrefiningforum/data/attachments/14/14072-699f204619c3d864c2a6dc3cd5776fa8.jpg)