billyb said:I'm getting pretty close to processing my first batch of fingers using the AP process for removing the gold fingers. My question is, can I put the cell phone boards in with the fingers? What else can I put in with the fingers? Thanks for your help.
dtectr said:Search for posts by texan on this topic.
texan said:dtectr said:Search for posts by texan on this topic.
The gold that you can see on a cell pcb is just the low hanging fruit. Most of the gold in a cell is hidden inside of components. You CAN NOT just dump a cell phone in some AP or AR as one poster here did. Some of the gold/other PM is very well hidden. Once by accident I cracked open a half inch flat pack....inside was an integrated circuit wafer, gold bonding wires and a separate gold plated ic all hidden/sealed inside the flat pack covering.
Texan
It's even better than that, Jim. It's mandatory.. (and thanks for the comment).jimdoc said:Punctuation, it is a nice invention.
Jim
Enter your email address to join: