kurtak
Well-known member
Most of this thread has been about depopulating RAM
IMO - there is only "one" way to do this --- put the RAM in a 5 gallon bucket (1/3 - 1/2 full) cover the RAM with HCl - give it about one hour for the HCl to react with the tin - pick the bucket up by the handle & twist/rotate the bucket back & forth - this gets fresh acid between RAM sticks that are touching each other - repeat bucket twisting/rotation about every 20 minute - 1/2 hour until it becomes evident chips & SMDs have come loose from board --- decant HCl & use same bucket twist rotate to do 3 or 4 water washes - separate boards from components (can be done with screening - or by hand)
Why HCl instead of some kind of heating :?:
Because with heat you have not eliminated the solder (tin) --- so - before you can move on to the recovery of your gold you still have to (at some point) do a HCl leach to remove the tin - other wise the tin is going to follow through the rest of your recovery processes
Therefore - IMO - get rid of the tin to start with &/or in THE FIRST PLACE
Just did about 40 pounds of RAM this way (& have been doing it this way for years)
Trust me --- I have tried ALL other methods will NEVER do it any other way then the way I just discribed
And it works on both the older types of RAM (older type chips) & on the newer BGA type RAM (chips)
Its the fastest - AND - it gets rid of the tin right out the gate
And - don't forget - the FINE black powder from dissolving the tin away contains "gold" (and antimony) as well - so let that fine black powder from you HCl decant & the water washes settle out for processing as well
Kurt
IMO - there is only "one" way to do this --- put the RAM in a 5 gallon bucket (1/3 - 1/2 full) cover the RAM with HCl - give it about one hour for the HCl to react with the tin - pick the bucket up by the handle & twist/rotate the bucket back & forth - this gets fresh acid between RAM sticks that are touching each other - repeat bucket twisting/rotation about every 20 minute - 1/2 hour until it becomes evident chips & SMDs have come loose from board --- decant HCl & use same bucket twist rotate to do 3 or 4 water washes - separate boards from components (can be done with screening - or by hand)
Why HCl instead of some kind of heating :?:
Because with heat you have not eliminated the solder (tin) --- so - before you can move on to the recovery of your gold you still have to (at some point) do a HCl leach to remove the tin - other wise the tin is going to follow through the rest of your recovery processes
Therefore - IMO - get rid of the tin to start with &/or in THE FIRST PLACE
Just did about 40 pounds of RAM this way (& have been doing it this way for years)
Trust me --- I have tried ALL other methods will NEVER do it any other way then the way I just discribed
And it works on both the older types of RAM (older type chips) & on the newer BGA type RAM (chips)
Its the fastest - AND - it gets rid of the tin right out the gate
And - don't forget - the FINE black powder from dissolving the tin away contains "gold" (and antimony) as well - so let that fine black powder from you HCl decant & the water washes settle out for processing as well
Kurt