DNIndustry
Well-known member
I disolved the gold off of some cpu lids the other day . A mixed lot of ceramic P.Pros and Gold plate.
I used a 2.5 normal Hcl and minimal Naclo. the 80/20 solder on the p.pros went fine and the still plated lid took a bit longer. once It was done I went away for a few hours. came back and the lid had become coated in black fuzz. it got pretty thick.
When working with alloys what metal takes the precedence in the series or does it have its own potential based on the mix...Anyone get a new orp meter lately?
I used a 2.5 normal Hcl and minimal Naclo. the 80/20 solder on the p.pros went fine and the still plated lid took a bit longer. once It was done I went away for a few hours. came back and the lid had become coated in black fuzz. it got pretty thick.
When working with alloys what metal takes the precedence in the series or does it have its own potential based on the mix...Anyone get a new orp meter lately?