- Joined
- Aug 24, 2010
- Messages
- 172
Thanks, have just been piling those up toIf your doing legged IC's this would be a problem. Any base metals would also get balled up with the gold. Once that happens the only way to separate them is large amount of acids. BGA style chips (with out the solder balls) maybe okay, but there will still be some copper to deal with.
I've never used one of those crushers so I'm not sure how the tiny hair like bonding wires will react with this method....since I never used one, then I could be wrong.
incinerate. I have several kilos of old purple Japanese NEC chips (ceramic?) with heavily gold filled legs and a window with visible gold leads that test at 23.999k. I'd planned to smash those chips in a big cast iron mortar and pestle I have, and classify, pan the grit for fine wires, part the legs, smelt the dried grit, then test and decide about further work. I can get more, perhaps ten more k. These are early to mid-1980s. The only trouble is if you crush chips with copper or tin/ aluminum alloy legs and don't classify them out early in the process, hold to process them separately if GF or GP. If the legs are Beryllium copper alloy, I'll just accumulate to take to a refiner. They never yield as much as we wish, but with care, enough to be worthwhile.