futurama140
Well-known member
- Joined
- Sep 6, 2016
- Messages
- 45
To start off, I have been reading Hoke's, and I am just making a dent in it, but I am familiar with several of the processes used such as AP/AR, sulphuric cells, and really most of the basics of the methods.
I did search but I didn't quite see what I was wondering, which is: Is it a viable option to dissolve the plating from MILSPEC and other fully plated non-ferrous pins in HCL/CL? It looks to be much quicker, because it seems to me that any other dissolved BMs in the HCL/CL that precipitate besides/along with the gold (fuzzy on the precipitation, but i'm reading) would have such a surface area that AP would work like a charm for a final refining before melting into a button.
Excuse my ignorance, but i dont believe i can understand the academic material without posing some questions about practical implementations.
Thanks!
(edited for punctuation ambiguity)
I did search but I didn't quite see what I was wondering, which is: Is it a viable option to dissolve the plating from MILSPEC and other fully plated non-ferrous pins in HCL/CL? It looks to be much quicker, because it seems to me that any other dissolved BMs in the HCL/CL that precipitate besides/along with the gold (fuzzy on the precipitation, but i'm reading) would have such a surface area that AP would work like a charm for a final refining before melting into a button.
Excuse my ignorance, but i dont believe i can understand the academic material without posing some questions about practical implementations.
Thanks!
(edited for punctuation ambiguity)