Hello,
Which cyanide derivative are you using? Cyanate? Ferrocyanide + oxidizer/persulfate?
Have you tried to increase the specific surface area of of zinc by treatment with lead nitrate?
You didn't wrote how you control the resulting exact pH? Au(CN)2- is stable up to pH =3 (in theory), but without precise control, free CN - may still appear in the solution. For what purpose do you use citrate buffer? (unless it's a gold plating electrolyte) Why not phosphoric acid?
In weakly acidic solutions, citric acid can be oxidized to acetodicarboxylic acid, which is then decarboxylated to form acetone. At shifted potentials, white flaky citric acid oxidation products can form in the volume of the solution, which are captured by the gold precipitate (usually, of course, this only appears during electrolysis).
If you are sure that there is no silver in the RAM contacts, then you probably do not need to do any calculations for competing reactions. In my country, in the manufacture of substrates and contacts for RAM chips, silver was first used, and only then a thin layer of gold was applied. As far as I know, the same principle was used by Intel in the contacts of the first Pentium CPUs. I don’t know how the matter is with electroplating in modern contacts of RAM chips. Once upon a time, I got into electroplating and we couldn't do an abrasion-resistant(!) electroplating of gold without silver.
Maybe you would like to read this https://www.researchgate.net/public...lver_and_gold_from_cyanide_leaching_solutions
Which cyanide derivative are you using? Cyanate? Ferrocyanide + oxidizer/persulfate?
Have you tried to increase the specific surface area of of zinc by treatment with lead nitrate?
You didn't wrote how you control the resulting exact pH? Au(CN)2- is stable up to pH =3 (in theory), but without precise control, free CN - may still appear in the solution. For what purpose do you use citrate buffer? (unless it's a gold plating electrolyte) Why not phosphoric acid?
In weakly acidic solutions, citric acid can be oxidized to acetodicarboxylic acid, which is then decarboxylated to form acetone. At shifted potentials, white flaky citric acid oxidation products can form in the volume of the solution, which are captured by the gold precipitate (usually, of course, this only appears during electrolysis).
If you are sure that there is no silver in the RAM contacts, then you probably do not need to do any calculations for competing reactions. In my country, in the manufacture of substrates and contacts for RAM chips, silver was first used, and only then a thin layer of gold was applied. As far as I know, the same principle was used by Intel in the contacts of the first Pentium CPUs. I don’t know how the matter is with electroplating in modern contacts of RAM chips. Once upon a time, I got into electroplating and we couldn't do an abrasion-resistant(!) electroplating of gold without silver.
Maybe you would like to read this https://www.researchgate.net/public...lver_and_gold_from_cyanide_leaching_solutions