IC chips
- Thread starter kole55
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patnor1011
Well-known member
Yes and no.
I once ran kilogram of IC where I got less than 2g. Some, not much but still some are out there which do not have gold inside. It is hard to identify them due to zillion of types around but from what I was told they were harvested form TV sets.
I once ran kilogram of IC where I got less than 2g. Some, not much but still some are out there which do not have gold inside. It is hard to identify them due to zillion of types around but from what I was told they were harvested form TV sets.
A
Anonymous
Guest
Hi Kole
If they are from networking equipment then the chances are good that they are the good yield ones. The gold flash on the corner is often a good indicator and IT kit tends to have better yields than TV ones.
Jon
If they are from networking equipment then the chances are good that they are the good yield ones. The gold flash on the corner is often a good indicator and IT kit tends to have better yields than TV ones.
Jon
Geo
Well-known member
Those chips will normally have a large heat sink of copper or aluminum inside the plastic body. It's not really a big problem but it will tear a blender up and can bust glass and plastic.
Geo
Well-known member
The bonding wires will be gold. There are so few of those types of chips that have aluminum bonding wires that you should assume that they all contain gold bonding wires. The heat spreaders I spoke of is large pieces of metal inside the plastic body.
Greetings to everyone in the forum. Here are the results of my previous post. I had 150 pieces of black chips BGA with a router (around 220 grams of chips) to look at this from my post before. this I added gold dust than 120 pieces of finger ram card and all along I melted. the result was 3.2 grams of 22k gold. I got about 2 grams of 225 g ic chips. I noticed that the method hcl-cl very difficult to dissolve gold from chips (great works of gold foil of finger) I know that the AR good process for gold from the chips. QUESTION: When you wash the dust with water, put the other materials (gold wire and gold dust and something rinsed dust from burned ic s) in the AP to dissolve copper and other base materials (magnetic material is separated with a magnet) after treatment with AP again, rinse with water and separate as much as can be more dust than burnt chips. Now my question is if there is no base metals that you can gold wire and gold dust directly melt the torch and whether it will interfere if there is still residual dirt from burned IC chips. whether the borax to separate dirt from gold. Whether this will work. Here are some pictures of gold. THANKS!kole55 said:
