oldtimmer
Well-known member
I used AP to disolve the copper on the boards, leaving the gold fingers, but still have the nickel platting is still left on the gold foil. What is the best way to remove it? Nitric acid? or other. If it is left on the gold foil and disolved along with the gold when using HCl+CL, what problems, if any, will it cause when dropping the gold put of the solution with SMB?
There is just too much good information here on the forum that one could spend a month and not cover it all. Only problem that I am having is trying to find detailed information as in the above question.
Secnond question is were is a good place to purchase some DMG for tesing solutions?
Thanks.
There is just too much good information here on the forum that one could spend a month and not cover it all. Only problem that I am having is trying to find detailed information as in the above question.
Secnond question is were is a good place to purchase some DMG for tesing solutions?
Thanks.