Crudmudgeon
Member
- Joined
- Aug 2, 2024
- Messages
- 15
If you're going to melt the gold, you could add copper as collector and not worry about panning. Run it in a copper cell to recover as slime.Maybe someone is before me with this. have not read all new posts.
Santa came with an idea to me !!!!
I think we are looking at the wrong place.
If looking in difficulty to pan we have particles from leafgold as most difficult , then wires(bonds) and easiest is balls. This due to the area/volume ratatio. Instead of messing with the bonds we should transform them in to Balls. This by a final heating treatment of the ash before panning.
Sometime ago someone (forgott who and where) postyed a photo if inciterated chips. He stated ha had to high temperature and therefor the bonds had melted. If i remember correctly the bonds had transfered into small balls and drop like forms. This suggest its possible to transform the bonds to ball like forms.
Before panning i therefor suggest a last heat treatment of the ash. By heating it up above golds meltingpoint the wires should melt and by surface tension retract into balls. Stiring might help here since gold particles might merge creating larger, more easy panned particles.
Why pan wires when you can pan balls?? Will cost you a little extra step but i thing it will be both faster and give less losses.
Happy new panning year for all of you!!
I haven't done this yet, but intend to this summer. I've recovered a bit over 2oz of gold in 8mo of doing IC chips... the washing of ashes has gotten old and seems unnecessary if you collect the gold in copper.