Sorry for the not so good description. It is a single layer boards. But, the traces run in both sides of the board and they follow all the way through the depth of the board. If I could get a good pic I would send it. But, it is so hard to see. I confirmed with the guy in our board room and the gold traces do run through the board. All be it very thin traces.
Through my experience i have seen similar boards, those had gold plating on surface and then the through holes had gold plating to, usually, high power boards have almost 1 mm holes which are bridges that go through the board to link the traces between them from one side to another and back, and even for components that are not surface mounted....(usually these power board have little to no surface mounted components, the old ones)
Usually have better yields than normal 0.1-0.3 mm through holes on modern boards.
Those (the holes) act similar to traces and have probably thicker plating then the surface layers, also the copper in these holes are thicker.
It is my opinion that the op is talking about these boards.
Please confirm if this is the case so the members here can help you out with the best process to recover the gold.
The solder mask can be removed with hot sodium hydroxide, although
i do not recommend it since its very dangerous.
You can burn it to ash (takes a lot of time and stinks like hell) and use a grinder to grind it to dust (much like the IC chips method), then wash it out and then treat it with acid. Labor intensive since you have to grind as small particles as you can. (I have tried with depopulated RAM boards to recover the copper and remaining gold traces, not worth the effort if you are not doing it in large, for experiment it was ok, but financially was not worth it)
No matter what process you will use there are advantages and disadvantages to it...
I hope this helps.
Pete.