integer1980
Member
- Joined
- Dec 31, 2011
- Messages
- 5
I've been reading this forum on and off for over a year now. I've been collecting old cellphones. Some I've found, some were given to me by friends/family and some were mine. So I've 40 or so.
I've cleaned all the tin covers, gave a nice sand bath to remove solder so I'm left with a flat PCB. I put eight clean boards into an AP solution. (2 parts muriatic acid, 1 part 3% peroxide.) This method worked great for my trimmed fingers (ISA/PCI boards)
With the cellphone boards the gold broke up and I can't pull out of the AP. Looks like glitter all in the solution.
So I've two questions:
Is there a way to extract the gold from the solution that I've left after the AP (With the small gold flakes floating around in)?
As in maybe throw in some nitric acid in. Possible to turn this to an AR solution.
Also, for future reference, what would be the overall best method of handling cell phone boards?
I've cleaned all the tin covers, gave a nice sand bath to remove solder so I'm left with a flat PCB. I put eight clean boards into an AP solution. (2 parts muriatic acid, 1 part 3% peroxide.) This method worked great for my trimmed fingers (ISA/PCI boards)
With the cellphone boards the gold broke up and I can't pull out of the AP. Looks like glitter all in the solution.
So I've two questions:
Is there a way to extract the gold from the solution that I've left after the AP (With the small gold flakes floating around in)?
As in maybe throw in some nitric acid in. Possible to turn this to an AR solution.
Also, for future reference, what would be the overall best method of handling cell phone boards?
