trooper123
Member
I need someone to kinda point me in the right direction. This is what I seem to understand --
HCI is used mainly for pins (still not sure on the definition of "pins". Some seem to elude to only cpu pins). This can be used at room temp or heated.
AP is for fingers. No heat.
If HCI only eats the base metals why can't/aren't both processes used for boards?
If AP DOES dessovle gold -- why use it ??
I have "kinda" gleemed the answers to these but I would like to hear the pros and cons from you who are accomplished at this.
And as a side question, Do you reccomend removing ALL components from PCB. If so -- how? I have an older cell phone board with lots of gold traces but a TON of SM's ?
HCI is used mainly for pins (still not sure on the definition of "pins". Some seem to elude to only cpu pins). This can be used at room temp or heated.
AP is for fingers. No heat.
If HCI only eats the base metals why can't/aren't both processes used for boards?
If AP DOES dessovle gold -- why use it ??
I have "kinda" gleemed the answers to these but I would like to hear the pros and cons from you who are accomplished at this.
And as a side question, Do you reccomend removing ALL components from PCB. If so -- how? I have an older cell phone board with lots of gold traces but a TON of SM's ?