Well, there may be several ways to do it, here is how I recover the metal contacts from a PC mainboards.
They contain gold, silver and palladium. Some other PMs and non-PMs may also be involved but that remains to be seen.
Preparation:
If the motherboard has a lot of electrolytic capacitors, I remove them with pliers and throw them away.
I remove the CPU if present and all components like cables etc, that can be easy detachted from the board.
Main process:
First step :
I remove the large and heavy non-plastic components from top/component side with hot air.
These are mostly flatpacks, coils, transistors, large tantalum and large MLCCs (ceramic capacitors)
![Tantal-3.jpg Tantal-3.jpg](https://cdn.imagearchive.com/goldrefiningforum/data/attachments/9/9595-0f91ccd857a8a4592f54aefa1b0bd472.jpg)
[youtube]http://www.youtube.com/watch?v=Do7e41GiCwI[/youtube]
Then I remove the plastic housings of the SIM sockets, PCI slots, CPU slots etc.
Here is a video on this:
[youtube]http://www.youtube.com/watch?v=2M08A1Eexo4[/youtube]
Second step:
I put the mainboard on two bricks. Lay a piece of paper underneath, and heat the bottom/solder side gently with 350°C in circling movements. Do not overheat one spot, so the PCB wont start to burn. The trick is to knock on the heated areas to make the contacts fall down. I collected 30g of material from this board.
My video on this one:
[youtube]http://www.youtube.com/watch?v=IzpZKSEwefc[/youtube]
Third step:
I remove the CPU socket by heating the bottom/solder side and let it fall down. Later I will show you, how to get the contacts out of the CPU socket. They contain PMs, too.
Fouth step:
Using some pliers, I remove all remaining larger components and those contacts that did not fall down.
Fifth step:
Turn the mainboard to component side and heat an area with small compoenents such as MLCCs or resistors. Use a scraper to scratch them down, while the solder is still hot.
Slapping the mainboard against the bricks will not work well for such a large PCB. Collect the components and sort them later.
Sixth step (optional):
If there is a lot of solder on the board heat it, scratch the solder with a scraper and collect it.
Alternative:
Use a Dremel and grind the solder. Collect the fine powder and melt it in later.
Final
If all the components have been harvested, all solder has been removed, you have a very flat PCB board with little values left in them.
They contain gold, silver and palladium. Some other PMs and non-PMs may also be involved but that remains to be seen.
Preparation:
If the motherboard has a lot of electrolytic capacitors, I remove them with pliers and throw them away.
I remove the CPU if present and all components like cables etc, that can be easy detachted from the board.
Main process:
First step :
I remove the large and heavy non-plastic components from top/component side with hot air.
These are mostly flatpacks, coils, transistors, large tantalum and large MLCCs (ceramic capacitors)
![Mlcc.jpg Mlcc.jpg](https://cdn.imagearchive.com/goldrefiningforum/data/attachments/9/9592-e2df1d792cd7d8bec932cf6bacf4fbf0.jpg)
![Tantal-1.jpg Tantal-1.jpg](https://cdn.imagearchive.com/goldrefiningforum/data/attachments/9/9593-907d96837491e50ff0ce6cebe52f8221.jpg)
![Tantal-2.jpg Tantal-2.jpg](https://cdn.imagearchive.com/goldrefiningforum/data/attachments/9/9594-3e474d7ff8281909fffcefe9b71e9984.jpg)
![Tantal-3.jpg Tantal-3.jpg](https://cdn.imagearchive.com/goldrefiningforum/data/attachments/9/9595-0f91ccd857a8a4592f54aefa1b0bd472.jpg)
[youtube]http://www.youtube.com/watch?v=Do7e41GiCwI[/youtube]
Then I remove the plastic housings of the SIM sockets, PCI slots, CPU slots etc.
Here is a video on this:
[youtube]http://www.youtube.com/watch?v=2M08A1Eexo4[/youtube]
Second step:
I put the mainboard on two bricks. Lay a piece of paper underneath, and heat the bottom/solder side gently with 350°C in circling movements. Do not overheat one spot, so the PCB wont start to burn. The trick is to knock on the heated areas to make the contacts fall down. I collected 30g of material from this board.
My video on this one:
[youtube]http://www.youtube.com/watch?v=IzpZKSEwefc[/youtube]
Third step:
I remove the CPU socket by heating the bottom/solder side and let it fall down. Later I will show you, how to get the contacts out of the CPU socket. They contain PMs, too.
Fouth step:
Using some pliers, I remove all remaining larger components and those contacts that did not fall down.
Fifth step:
Turn the mainboard to component side and heat an area with small compoenents such as MLCCs or resistors. Use a scraper to scratch them down, while the solder is still hot.
Slapping the mainboard against the bricks will not work well for such a large PCB. Collect the components and sort them later.
Sixth step (optional):
If there is a lot of solder on the board heat it, scratch the solder with a scraper and collect it.
Alternative:
Use a Dremel and grind the solder. Collect the fine powder and melt it in later.
Final
If all the components have been harvested, all solder has been removed, you have a very flat PCB board with little values left in them.