I process a lot of ceramic ic's/processors lately, AR works fine but +/- 10% of the silicon die's are still stuck to the ceramic and leaving somme gold.
Is there a way to remove these?
I usually heat the chip to release the cap. Once the cap is removed I continue with heating in the chip until that die can be picked right off with pliers or tweezers.I process a lot of ceramic ic's/processors lately, AR works fine but +/- 10% of the silicon die's are still stuck to the ceramic and leaving somme gold.
Is there a way to remove these?
From the legs to the die inside the ceramic is that also gold plated? That would be a reason to granulated I guess...In a commercial refinery, one which see's a lot of these processors sent in as a separate scrap type, would granulate this material before processing them in aqua regia. The theory being the smaller pieces allow better penetration of the acids and digest more of the values.
Also note that the refiners processing this material in aqua regia also save the residues because they can never be totally stripped of all of their values in AR. (If properly granulated to small enough pieces you will get most of the gold but some remains.) The residues are melted in a furnace with copper and cryolite which will dissolve the ceramic. It is a slow process requiring a long heat to melt the ceramics. And it eats up crucibles as well.
If you think for one minute a commercial refiner has the chip by chip specifics about these circuits that a lot of members here have you are mistaken. Commercial refiners will not pick through the chips they simply toss tbe lot in the granulator.From the legs to the die inside the ceramic is that also gold plated? That would be a reason to granulated I guess...
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