maynman1751
Well-known member
Joe! You need to do some more reading and studying. You are making way too many mistakes and compounding your problems.Looks like another oversight. I have been using 70% nitric acid with no water. All the water in my lab (I like the sound of that) has been distilled arrowhead. I don't see how any hcl could have contaminated my nitric solution. I assume the contamination is from the board itself when the green film lifted off exposing the glue or whatever was holding it on. Everything was fine till that happened. I have taken out the boards and set them aside, they were coated with slime. Is that slime tin or is it tin+gold?
I, myself, am fairly new to this , but through reading and researching the forum, I will tell you what I see (my opinion).
1. I would not do entire boards.
2. I would not use Nitric to remove base metals when HCl/Peroxide will work just fine (but slower) and is much cheaper.
3. If you are going to use Nitric it should be diluted 50/50.
4. The full strength Nitric may be the reason that the green film (solder mask) has come loose and exposed large amounts of copper trace that is being dissolved unnecessarily in the reaction therefore exhausting your acid needlessly.
These are just a few things that I thought that I would point out. I believe most of them have already been covered by other members already. If I am wrong on any of these points I'm sure that I will be corrected. Continue to let Butcher guide you through this stage and then, if it where me, go with the AP, HCl/Cl processes until you get better acquainted with what you are doing. I am by no means an authority on this. Just trying to give some friendly advice.
Read the forum daily. The mistakes that you are making are discussed here on a daily basis. Learn from the others mistakes to avoid making the same ones yourself. Don't be discouraged. Just work smarter!