Dr_Code
Active member
- Joined
- Sep 21, 2012
- Messages
- 26
These are only examples of the types of material. I don't plan to process the three items and only the items.
From top to bottom: LCD board, RAM, and CPU board from a laptop. Scrach testing the traces show they are copper under the solder mask. Is it necessary to depopulate the boards with a hot sand bath, then hot lye to remove the solder mask, and then AP?
The LCD board does seem to have some sort of clear glue over the fingers. I assume this was to hold on the thin plastic part that attached it to the actual display. I am leaning towards the hot lye solder mask removal for that particular type of scrap.
I want to do things right, but on the other hand, no sense wasting chemicals and time on an unneeded steps.
From top to bottom: LCD board, RAM, and CPU board from a laptop. Scrach testing the traces show they are copper under the solder mask. Is it necessary to depopulate the boards with a hot sand bath, then hot lye to remove the solder mask, and then AP?
The LCD board does seem to have some sort of clear glue over the fingers. I assume this was to hold on the thin plastic part that attached it to the actual display. I am leaning towards the hot lye solder mask removal for that particular type of scrap.
I want to do things right, but on the other hand, no sense wasting chemicals and time on an unneeded steps.