Thin polymer CPUs - TCP (Tape Carrier Package)

[haveagojoe]

I have 4 of these interesting-looking chips which are from 90s Compaq laptops, they are on a thin polymer substrate which is similar to ribbon connectors. Two are labelled TT233 SL28Q, one I can't read and one has the markings covered with foil.
Would I be correct to assume that the gold on the tracing is plated onto a copper layer and should therefore go into a copper chloride leach, or should they go straight to AR?

 

[Martijn]

I would toss one in AR and watch how it goes.
Let us know if you have a result.

 

[patnor1011]

Do you see that black substrate or epoxy around center die? That is where you find gold bonding wires.

 

[haveagojoe]

Do you see that black substrate or epoxy around center die? That is where you find gold bonding wires.

Yes after a bit more research I believe these are basically the same as the black fibre type CPUs, so the visible gold traces are just plated onto copper while the centre can be treated the same as plastic ICs by pyrolizing and incinerating and then crushing and separating. I think I will cut the outer part off with scissors and throw it in with my next AP batch and put the centre part in with my ICs.

 

[kurtak]

Just incinerate them "as is" - crush to liberate the bond wires from the epoxy part - then leach both the bond wires & the gold plated copper leads in AR - the "small" amount of copper here is not a problem to leach both with AR

Kurt