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Thin polymer CPUs - TCP (Tape Carrier Package)

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haveagojoe

Well-known member
Joined
Aug 1, 2014
Messages
197
I have 4 of these interesting-looking chips which are from 90s Compaq laptops, they are on a thin polymer substrate which is similar to ribbon connectors. Two are labelled TT233 SL28Q, one I can't read and one has the markings covered with foil.
Would I be correct to assume that the gold on the tracing is plated onto a copper layer and should therefore go into a copper chloride leach, or should they go straight to AR?

polymer chips front.jpgpolymer chips back.jpg
 
Do you see that black substrate or epoxy around center die? That is where you find gold bonding wires.
Yes after a bit more research I believe these are basically the same as the black fibre type CPUs, so the visible gold traces are just plated onto copper while the centre can be treated the same as plastic ICs by pyrolizing and incinerating and then crushing and separating. I think I will cut the outer part off with scissors and throw it in with my next AP batch and put the centre part in with my ICs.
 
I have 4 of these interesting-looking chips which are from 90s Compaq laptops, they are on a thin polymer substrate which is similar to ribbon connectors. Two are labelled TT233 SL28Q, one I can't read and one has the markings covered with foil.
Would I be correct to assume that the gold on the tracing is plated onto a copper layer and should therefore go into a copper chloride leach, or should they go straight to AR?

View attachment 66417View attachment 66418
Good afternoon
I would do a leaching with hno³ first and then separate the ag and possible pd as nitrates. After a good wash with hot water in a filter, it would be transferred to air. I would take the smallest amount of metals possible for my AR, prioritizing better quality gold for the next refinement.

Direct air requires more experience and if you are not careful when adding hno³ it can create problems or mess.
 

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