I found that a single black pyrolyzed IC when put into a spoon with molten sodium hydroxide dissolved the IC apart quite well. I don't know yet if it is practical, and also the silicon chip started fizzing and burning in the sodium hydroxide, so it may be too violent when scaled up to a volume of ICs.
I speculate the hydroxide dissolves the glass filler material and you are left with some carbon, gold wire and legs. I also don't know if the sodium hydroxide would dissolve gold or silver, which could be a problem if it does. I think this idea has potential for higher value material like NS bridges and such.
Note: I did this with a single chip, I advise extreme caution in performing or scaling up this experiment. Sodium hydroxide when molten goes off as a vapor into the air even when it isn't bubbling, which is bad. Silicon and possibly other metals in the chip react very exothermically! This is possibly more dangerous than the wet ashing... but I thought it was still worth bringing up for discussion.
I speculate the hydroxide dissolves the glass filler material and you are left with some carbon, gold wire and legs. I also don't know if the sodium hydroxide would dissolve gold or silver, which could be a problem if it does. I think this idea has potential for higher value material like NS bridges and such.
Note: I did this with a single chip, I advise extreme caution in performing or scaling up this experiment. Sodium hydroxide when molten goes off as a vapor into the air even when it isn't bubbling, which is bad. Silicon and possibly other metals in the chip react very exothermically! This is possibly more dangerous than the wet ashing... but I thought it was still worth bringing up for discussion.