AurumShine
Well-known member
I use aqua regia (HCL,HNO3) for dissolve (Blended flat pack ,IC) fibre cpus,card figure ,cell phone print board ,pins with out removing base metals in AP and nitric acid that method is good or bad
my second question is that I use this method any metal or ceramic
precipitate the gold in 1st step same as silver and copper in nitric acid when we put the silver and copper together in nitric acid copper precipitate the silver.
my second question is that I use this method any metal or ceramic
precipitate the gold in 1st step same as silver and copper in nitric acid when we put the silver and copper together in nitric acid copper precipitate the silver.