Hi everybody,
I am reading the forum for a month already and have read Hooks book all about gold -few times, and made a lot of notes. I have now something like 70 CPUs (all kinds) so I am slowly planning to do my first refining of 10 ceramic cpus...
So I would be very greatfull if you could advice me a little before my first refine...
Here are few things which are important for my case:
-I will do refining outside on a windy day in countryside so my process must be fairy quick (within 16 hours) because I would like to avoid camping outside for days (weeks) . For this I decided to use AR method.
Poor Man's AR I can not use because it is difficult for me to get sodium nitrate...
Basically I plan to follow Hooks procedure for "Rolled, Filled and electroplated gold, and gold scrap containing soft solder" -page 67.
Any advice to speed up the proces ? Some step to take out or to include ?
You guys never boil CPUs or pins in Sulfuric Acid, I wonder why ? There is a Pb in solder.. right...
Hoke is using a lot of time on settling the sediments (days) and then pouring of the liquid. I plan to use finest quality filter paper and vacum filtering to avoid spending time on settling all together? Is this sound idea ?
Is there any big diference between Poor Man's AR and clasic AR metod with 65% Nitric Acid ?
Thanx...
I am reading the forum for a month already and have read Hooks book all about gold -few times, and made a lot of notes. I have now something like 70 CPUs (all kinds) so I am slowly planning to do my first refining of 10 ceramic cpus...
So I would be very greatfull if you could advice me a little before my first refine...
Here are few things which are important for my case:
-I will do refining outside on a windy day in countryside so my process must be fairy quick (within 16 hours) because I would like to avoid camping outside for days (weeks) . For this I decided to use AR method.
Poor Man's AR I can not use because it is difficult for me to get sodium nitrate...
Basically I plan to follow Hooks procedure for "Rolled, Filled and electroplated gold, and gold scrap containing soft solder" -page 67.
Any advice to speed up the proces ? Some step to take out or to include ?
You guys never boil CPUs or pins in Sulfuric Acid, I wonder why ? There is a Pb in solder.. right...
Hoke is using a lot of time on settling the sediments (days) and then pouring of the liquid. I plan to use finest quality filter paper and vacum filtering to avoid spending time on settling all together? Is this sound idea ?
Is there any big diference between Poor Man's AR and clasic AR metod with 65% Nitric Acid ?
Thanx...