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This pdf is a comprehensive overview of the chemical content and therefore also the PMs in the semiconductor devices from Philips until 2003.
It gives the mass and the material of the bondwire, the leadframes and other components.
The type of device should give you a good hint, on what to expect, even though the parts you want to research were not produced by Philips.
Just look for similarities such as pincount, case. The names of the semiconductors are only the names of the housing! So any chip with any function, with this particular housing will have the same results! (if they are from Philips, but likely from other companies as well)
http://tec.icbuy.com/uploads/2009/10/13/75008703.pdf
More info on the naming of the housings:
http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types
This how you should use it to calculate your PM content:
- Find out the casing of your IC
- Take the one representive from the group and upscale/downscale the data.
If the sample shown is TSSOP24, that means it has 24 pins. If your IC has 48 pins but the same case, double the number and therefor the mass of the bondwire. (0,6mg x 2 = 1,2mg Au bondwire / chip ). This is not exact but should do it.
If my english is too bad or humble, please correct.
This pdf is a comprehensive overview of the chemical content and therefore also the PMs in the semiconductor devices from Philips until 2003.
It gives the mass and the material of the bondwire, the leadframes and other components.
The type of device should give you a good hint, on what to expect, even though the parts you want to research were not produced by Philips.
Just look for similarities such as pincount, case. The names of the semiconductors are only the names of the housing! So any chip with any function, with this particular housing will have the same results! (if they are from Philips, but likely from other companies as well)
http://tec.icbuy.com/uploads/2009/10/13/75008703.pdf
More info on the naming of the housings:
http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types
This how you should use it to calculate your PM content:
- Find out the casing of your IC
- Take the one representive from the group and upscale/downscale the data.
If the sample shown is TSSOP24, that means it has 24 pins. If your IC has 48 pins but the same case, double the number and therefor the mass of the bondwire. (0,6mg x 2 = 1,2mg Au bondwire / chip ). This is not exact but should do it.
If my english is too bad or humble, please correct.
