A
Anonymous
Guest
g_axelsson said:I think the idea is dead in the water. The solder will stick to the metal it sits on, it's called surface tension. To have it in a fluid will just help it against the force of gravity, if it doesn't drop off when melted in air, why should it do it in a liquid where the liquid will make the tin less heavy.
The solder will also dissolve more metals while molten, for example copper, and become more stuck to the surface (or maybe it is oxides).
Anyhow, anyone that have replaced soldered components knows that when you have worked with molten tin for too long it get's harder to melt and the best way to fix it is to remove the old tin and add new.
Göran
Goran I agree that if you were letting them sit inert in the liquid that it would be pretty pointless. However if you were agitating the boards it could work. Now don't think that I'm being a complete fruitloop here but what about stacking cards vertically and combining the heat with ultrasound or a vibration generator? Alternatively you could have a dipping mechanism. Either way it could work.