If you do not say what you mean,or explain your comments well, and you do not state details the best you can, or explain what you are trying to say in detail, you leave what you say up to assumptions, where the reader has to assume, or you leave your comment up to assumption of the reader, where you can be easily misunderstood.
Also with many of us here speaking different languages there are also problems with translating the messages, which can further lead to confusion.
Solar was assuming with safety in mind for other readers, and without better details what else would be expected, without more details many of us here concerned for others safety would do the same thing.
You should be clear of what you are talking about (as best as you can), especially when discussing a dangerous process, or one that someone can make assumptions of, and could become (in the wrong hands) a very dangerous process, with little details and assumptions of unclear statements, a very dangerous process could result getting a new member hurt or crippled for life.
I see no benefit to using the sulfuric acid (whether assisted with H2O2 oxidizer or not), on these gold powders, in fact I believe it would be a mistake, especially if this material came from electronic scrap, where any remaining lead in the gold would form an insoluble lead sulfate, contaminating the gold and making it brittle after melting.
With the normal process we use and the gold washing procedure of the gold wash we can eliminate lead as a soluble chloride in boiling hot water rinses.
I see no benefit at all to using sulfuric acid to dissolve copper (over the conventional copper II chloride leach), whether you are speeding up the process with a little O2 addition from H2O2 or not.
there are times where I choose to use sulfuric acid to remove base metals (sometimes even as a replacement for nitric acid a process I will not go into detail because of its dangers), but for general use I like the copper II chloride leach to dissolve copper (when nitric acid is not an option) especially for fine copper metal from electronic scrap, the chemicals are cheaper (for me), and I can rejuvenate the CuCl2 leach for very little cost, and reuse it again, this not only lets me dissolve more copper for less money but also helps to lower cost and trouble in the waste stream (although when I do make copper sulfate it is normally reused in other processes).
Actually I believe you can dissolve gold as a sulfate if the H2SO4 acid and H2O2 where concentrated enough (extremely dangerous process, which would just be stupid to try), but the gold would not stay dissolved long as a persulfate of gold, as I believe it would be unstable as a gold persulfate,. My thinking on this would not be much different than using the concentrated sulfuric acid gold deplating cell where gold is dissolved at the anode, but as the gold per-sulfate leaves the highly oxidizing environment of the anode area the unstable gold per-sulfate converts back to gold metal powder and sulfuric acid, also similar to this process in the electrolytic cell, a strong peroxymonosulfuric acid H2SO5 would likely passivate copper (with an oxidation layer) at least until the solution lost its overly strong oxidation power.
Again I see little benefit here with this method of using sulfuric acid to dissolve copper making copper sulfate.