I am sorry but this post is absolutely FULL of mis-information !!!
First of all - lets talk about the pins (from electronic scrap) the pins can be made of "many" different metals
so what acid you use will depend on the pins
pins can be brass - an alloy of copper & zinc - the most common type pins - & will most certainly FULLY dissolve in nitric
or they can be made of phosphor bronze - an alloy of copper & tin - & although found in E-scrap are less common then brass pins - because of the tin in them - yes - nitric will cause the "goo" you saw - (we will talk more about that goo) therefore your 20 gram sample was likely phosphor bronze
my point is that just because you had 20 grams of phosphor bronze pins does not mean that nitric doesn't work to dissolve pins because the fact is MOST pins are brass which will fully dissolve in nitric
then - though rare - pins can be actual copper - which again will "fully" dissolve in nitric
Then there are pins made of kovar - most commonly found on CPUs - they will dissolve with ether nitric or HCl - kovar is very difficult to dissolve & the acid (nitric or HCl) needs to be HOT - straight "hot" HCl works better then straight hot nitric on kovar - however --- you can improve the dissolving of kovar by using nitric with the addition of some sulfuric - it takes
VERY LITTLE sulfuric to improve the reaction of nitric on kovar
then there are SS (Stainless Steel) pins - also not real common - nitric does not react with SS so wont dissolve them - HCl however will - but slow doing so & creates a lot of waste - so there is another method that can/will recover gold from SS pins - it's call
reverse AR --- reverse AR is a bit of a tricky process that uses MORE nitric & VERY little HCl - but it will strip (dissolve) the gold from the SS & leave the SS untouched by the acid (when done right)
Now then - lets talk about aluminum & nitric (& the supposed aluminum nitride goo)
Nitric - unless
VERY dilute - does not react with aluminum - rather - what nitric does with aluminum - is it creates a VERY thin (few atoms thick) aluminum "oxide" layer on the surface of the aluminum - that (few atoms) oxide layer creates a passivation layer thereby preventing the nitric from reacting with the aluminum - in other words - prevents the nitric from dissolving the aluminum &/or turning it into some kind of goo
Now then - lets talk about this so called tin oxynitrate (or tin goo)
In the world of refining - that "tin goo" is called meta stannic acid (or stannic tin for short) - & yes - that goo is caused by the reaction of tin with nitric - which can be the result of solder or bronze (not brass)
Therefore - though yes - when processing pins with nitric - you may well encounter this problem of meta stannic acid (the goo) - whether as a result of solder - or bronze --- there is actually a "very simple" way of dealing with the stannic tin
First (like most every other process we do in refining) you wash the acid out of the solids --- in this case it would be the gold foils along with the stannic tin
Once you have washed the (nitric) acid out (at least MOST of it) you can then dry the foils & stannic tin
after drying you then incinerate the foils/stannic tin
the incineration process causes the stannic tin to convert to tin oxide - the tin oxide can then be simply dissolved away with HCl - which then allows you to dissolve your foils with AR or HCl/bleach
You can read more about dealing with stannic tin here
https://goldrefiningforum.com/threads/metastannic-acid-experiment.15324/#post-236142
as well you can do a search of other things I have posted about stannic tin using stannic tin as search words & my user name as I have posted much about dealing with stannic tin over the years
In other words - the rest of your post (& the B.S. about hydroxyquinones) is just that -
pure B.S.
Therefore I will not even comment on the rest of your post - for there is a simple - long proven method for dealing with stannic tin - if/when created
Kurt