Graphics cards

[FiP]

What you see there is gold plated copper wire. It will completely dissolve in nitric, amount of plating is negligible. That plating will not cover cost of NaOH not to mention cost of nitric. I see a lot of them when I process BGA, after incinerating, crushing and sieving they tend to accumulate in lumps however they are gone after Nitric cleaning of concentrate. Gold bonding wires are usually just about 1mm long. When they accumulate difference can be easily spotted.

Hello

Thanks Patnor!
The interesting black part with the gold bonding wires will be incinerated.
For this bit i had a batch of sim cards and other stuff that needed to go in an NaOH bath, so i took the opportunity to clean it that way.
Now i was thinking processing it along other stuff in AP cycle.

All the best!