green processors(fiber)

[Barren Realms 007]

They should be pretty much the same.

 

[patnor1011]

Okay guys, looks like I have made yet another mistake. I didn't look closely enough at the first picture, I have the chips like are shown in the picture that patnor1011 posted. I am learning.

You didn't they are pretty much the same as Barren said.

 

[dtectr]

of 7 of these that i cracked open at random, ALL had the very fine gold wires pictured here, but they are difficult to spot -
i had to use my OptiVisor knock-off with highest magnification to verify, but here's the proof.

EDITTED 05 OCT: After conferring with lazersteve, I realized that what I was calling "ceramic" & what he was calling "epoxy" are actually closer to what he was describing - namely, thermoset plastic. These tops & the gold bonding wires they contain are NOT from ceramic CPUs or lids, but from plastic ones.

I didn't want to be responsible for sending anyone on a wild goose chase.
jordan

 

[lazersteve]

I have found that the epoxy encapsulated integrated circuits and cpus are the ones most likely to have the solid gold wires, whereas the ceramic style typically don't. Of course there are always exceptions.

Steve

 

[Geld Konig]

Edwardbeard

I think AP process is NOT for this ICs. Try AR ( acqua regia- 4 HCl + 1 HNO3) after mill very well those ICs. You can try NaCN 0,2% with some H2O2 3 %. Or use HCl + sodium hipoclorite( clorox) 2%. Each process have his precipitated agents and way to do this.

 

[patnor1011]

Edwardbeard

I think AP process is NOT for this ICs. Try AR ( acqua regia- 4 HCl + 1 HNO3) after mill very well those ICs. You can try NaCN 0,2% with some H2O2 3 %. Or use HCl + sodium hipoclorite( clorox) 2%. Each process have his precipitated agents and way to do this.

I suggested AP for bottom - green part. Black part need to be crushed then AR.

 

[shyknee]

so does any one have a good average on these BGAs, That is not a guess ?

 

[dtectr]

so does any one have a good average on these BGAs, That is not a guess ?

Nope.

 

[samuel-a]

actually, i do have yield data and posted them before.

Thing is, i didn't kept record of weights so it turns out kinda tricky, here goes;
When i did them last time, i scraped the gold leads (and corner) from the fiber part and added them to the plastic part and grind them together to powder.

Of this powder mass, my yield was 1% which was very surprising and nice.

I have another batch waiting for my attention, this time i will surely keep records more tightly and update when have results.

 

[gold4mike]

Samuel,

What method are you using to grind them?

 

[samuel-a]

Incineration, then Ball Mill.

 

[Anonymous]

I suggested AP for bottom - green part. Black part need to be crushed then AR.

I wouldn't suggest using AR on the top parts.It reacts with the nitric and swells up.I have had pretty good success smelting small amounts.I won't know until next week if it will be feasible to small large amounts.

 

[Anonymous]

I know this is an older subject,but I am going to grind some various BGA's and process them with a chlorine leach.
I will start a new contest with the winner picking a prize out of some chips,that will be posted before hand.I will stipulate the rules before hand and let everyone guesstimate a yield like before.

 

[samuel-a]

I know this is an older subject,but I am going to grind some various BGA's and process them with a chlorine leach.
I will start a new contest with the winner picking a prize out of some chips,that will be posted before hand.I will stipulate the rules before hand and let everyone guesstimate a yield like before.

Hi Mic.

I really think you'd be better off using dilute AR rather then Cl leach.
I don't know what parts of the BGA exactly are you gonna put there, but leaching those with Cl may prove very time/materials consuming.

If you include the fiber part, probably 2-3 AR leaches will be needed, if only the tops and the visible gold from the bottom fiber (as i suggested earlier in this post) you will do fine with 1 AR leach.