Hi, First of all, what a fantastic forum! I will be able to find a lot of information here and hopefully contribute a bit too.
I have some questions about plated material and reverse electroplating.
Is there any way to find out the thickness of the plating, this to be able to calculate the gold content of the material that can be extracted?
In the reverse electroplating it is reported that it requires the use of sulfuric acid, a basket cage of copper (which is loaded on the plus side) and a cathode made of lead (which is loaded on the negative side). Can a basket of stainless steel used instead?
Can the method of reverse plating be used to extract gold from CPU´s`?
Does it has to be concentrated sulfuric acid, or may use, for example battery acid if you give the process more time? This would facilitate the availability of acid.
When you read about it, as it seems, a part of the gold is falling trapped into the acid. Is there any way to get the gold on the cathode?
How many times can acid reused?
Looking forward to answers!
I have some questions about plated material and reverse electroplating.
Is there any way to find out the thickness of the plating, this to be able to calculate the gold content of the material that can be extracted?
In the reverse electroplating it is reported that it requires the use of sulfuric acid, a basket cage of copper (which is loaded on the plus side) and a cathode made of lead (which is loaded on the negative side). Can a basket of stainless steel used instead?
Can the method of reverse plating be used to extract gold from CPU´s`?
Does it has to be concentrated sulfuric acid, or may use, for example battery acid if you give the process more time? This would facilitate the availability of acid.
When you read about it, as it seems, a part of the gold is falling trapped into the acid. Is there any way to get the gold on the cathode?
How many times can acid reused?
Looking forward to answers!