Great contribution anarxi. I hope you are well.
There is a similar concept in a US or Canadian patent (hope I can find it again) which uses a "special liquid" described as "heat transfer medium." Perhaps it is oil-based; if so, high pressure seals might not be needed.
I would love to have a miniature of this processor to use for RAM sticks (in say 2-10 kg batch sizes). Any suggestion?
A huge amount of academic literature describes hydrometallurgical methods involving chopping/grinding/ dissolving using various solutions. Many involve multi-step processes to first recover copper, then get the gold. Lead, tin, and silver are problematic because they slow down dissolution of the valuable metal.
Thanks KalleMP for another way to skin the cat. Here's another: a Chinese patent for a purely mechanical system that scrapes the solder off (CN105818189B). I can post a translated copy if you're interested, but for me it's"better living through chemistry"
Best,
Lee