I think we're talking apples and oranges here.
Using dilute sulfuric (say, 10-15%) will dissolve the copper base without dissolving the gold and the gold can then be collected as flakes. The problem would be at the cathode. If the copper base is pure, a sound deposit can be achieved. If not pure, the deposit will likely be fluffy and non-adherent and this can cause all sorts of problems.
Using a much more concentrated sulfuric will remove the gold, which precipitates as a powder, without attacking the copper or most other base metals. In the original patent on this, #2185858, Mason suggests using 1.65 SG (about 74%, by weight) sulfuric. In my experience, this is too weak and, especially when it heats up from the electrolytic reaction, it will attack the copper. However, to get any speed at all, some water is needed. Using technical grade sulfuric, which is usually about 95-96%, I add 5% water, by volume. When diluting, ALWAYS ADD THE ACID TO THE WATER!!! and NOT the water to the acid.