Everyone is talking about tin, but it should be solder. 60% tin, 40% lead. In the border zone between solder and copper it would create a lot of different alloys between copper, tin and lead. No wonder that hydrochloric acid has a hard time to dissolve all the solder.
And I agree with everyone that says that the value is in the chips only.
Any talk about conformal coating is just wrong, it would create a good isolating surface and you wouldn't get any electrical contact, kind of contradicts what is sought after, a good electrical contact to conduct the signals between the CPU and the memory.
Göran
And I agree with everyone that says that the value is in the chips only.
Any talk about conformal coating is just wrong, it would create a good isolating surface and you wouldn't get any electrical contact, kind of contradicts what is sought after, a good electrical contact to conduct the signals between the CPU and the memory.
Göran