drlonzo
New member
First and foremost I want to thank everyone that has posted in this forum with their valuable knowledge and unique problems. It makes for some great reading. I'm new at this new age PM mining, however i've managed to find most of what I wanted and needed to know by reading HOKE and on the forum. I've now started to actually start removing some of the components from the boards that i've amassed over the last little while. So far i've been primarily been using the mechanical and heat methods by pulling loose what i can and using a heat gun to melt solder etc. I'm wondering if anyone has or is using HCI by itself to remove components after removal of the caps and major metal connectors. I'm sure it takes time without heat but does anyone use it to any degree :?: