solar_plasma
Well-known member
No, he has no clue about the "magic" of CuCl2-"kungfu", when he uses that much H2O2, he might even dissolve some gold and dispose it. This is like using a laser scalpel as a hammer.
AP=CuCl/CuCl2/HCl+O2-system is really interesting and can be used, but there is a little more to learn about it, than just using nitric instead. So, you're fine with nitric for this project.
So the process for the foils is the same. If you also want to incinerate the chips, you will need nitric for leaching basemetals and AR for the gold bondwires on them to work through the fine white ashes, which also can be gravity separated before leaching. But this is another story and link. Better have the focus on the easiest stuff now: plated fingers and traces.
AP=CuCl/CuCl2/HCl+O2-system is really interesting and can be used, but there is a little more to learn about it, than just using nitric instead. So, you're fine with nitric for this project.
So the process for the foils is the same. If you also want to incinerate the chips, you will need nitric for leaching basemetals and AR for the gold bondwires on them to work through the fine white ashes, which also can be gravity separated before leaching. But this is another story and link. Better have the focus on the easiest stuff now: plated fingers and traces.