x-box cpu

[kurtak]

This is some great info - thanks guys 8)

Kurt

 

[macfixer01]

Well that was a waste of frickin' time! After they suckered me in to signing in just so I could download this document, only THEN did it tell me the owner marked it private so it can't be downloaded anyway!

I'm sorry for your time,and your trouble.
I have set it to public.
The last documents i uploaded were private and it remembers the last settings.


Best regards,

Thank you!

 

[g_axelsson]

Göran, reading your document, I think it is rather a SPGA than a TPGA, since the TPGA seems not to be gold bonded and I clearly saw a lot of gold wires within the xbox IC. That would be another important note, if not all ICs with this kind of copper heat spreader would contain gold at all.

I think you mean SBGA, not SPGA which is a pin grid array. Byt yes, I think you are corrrect, the number 16 is a SBGA or a Metal-BGA according to this page http://www.ecplaza.net/product/metal-bga-metal-ball-grid--65713-93732.html
There's a jungle of different versions out there and there doesn't seem to be much of a standard when it comes to naming these packages, seems like every maker uses their own names sometimes. I like the name metal-BGA as it is quite descriptive and explains what it is.

On this page http://www.analog.com/en/technical-library/packages/bga-ball-grid-array/sbga-w-heatsink/index.html there is a link to a pdf detailing the material used in one SBGA, http://www.analog.com/static/imported-files/packages/46018980SBGA_40x40_432_BP_D_122206.pdf
Copper heat sink 74%, gold bond wires 0.2067% (0.019g), gold plating on substrate 0.0216% (0.002g). There's also some silver in the glue that holds the chip, 0.0076% (0.007 g)
Total weight 9.24g and total Au 0.23% (0.021g / IC, or 90 cents a piece at a $1200/ounce price level.

Another interesting thing we can see is the filler in the molding compound, SiO₂. That is the "ash" we have left after incinerating a chip. It amounts to 73% so after incineration we still have roughly 3/4 of the mass left, the plastics we burn away is only 27% of the mass.

further, I can't believe that the yield is calculated inclusively the heat spreader. If the IC weighs 20g with heat spreader, this would mean, that one of those ICs yields more than half a gram. Even if it weighs 10g this would be equal to the best ceramic CPUs, calculated per piece.

Time to do a reality check, either the numbers are wrong or your math... hint, check your math! :mrgreen: 0.279% of 20g is 0.056g and if the weight is the same as the one above then it is closer to 10 grams with 0.028g Au.

Göran

 

[necromancer]

solar_plasma has a clear-cut disclaimer in their signature line.


here is the beginning of that disclaimer:
"Everything I write on the forum regardless the wording may contain false or incomplete statements"

guess you can not be any more honest then that, you may want to take it as face value.

 

[solar_plasma]

Göran, reading your document, I think it is rather a SPGA than a TPGA, since the TPGA seems not to be gold bonded and I clearly saw a lot of gold wires within the xbox IC. That would be another important note, if not all ICs with this kind of copper heat spreader would contain gold at all.

I think you mean SBGA, not SPGA which is a pin grid array. Byt yes, I think you are corrrect, the number 16 is a SBGA or a Metal-BGA according to this page http://www.ecplaza.net/product/metal-bga-metal-ball-grid--65713-93732.html
There's a jungle of different versions out there and there doesn't seem to be much of a standard when it comes to naming these packages, seems like every maker uses their own names sometimes. I like the name metal-BGA as it is quite descriptive and explains what it is.

On this page http://www.analog.com/en/technical-library/packages/bga-ball-grid-array/sbga-w-heatsink/index.html there is a link to a pdf detailing the material used in one SBGA, http://www.analog.com/static/imported-files/packages/46018980SBGA_40x40_432_BP_D_122206.pdf
Copper heat sink 74%, gold bond wires 0.2067% (0.019g), gold plating on substrate 0.0216% (0.002g). There's also some silver in the glue that holds the chip, 0.0076% (0.007 g)
Total weight 9.24g and total Au 0.23% (0.021g / IC, or 90 cents a piece at a $1200/ounce price level.

Another interesting thing we can see is the filler in the molding compound, SiO₂. That is the "ash" we have left after incinerating a chip. It amounts to 73% so after incineration we still have roughly 3/4 of the mass left, the plastics we burn away is only 27% of the mass.

further, I can't believe that the yield is calculated inclusively the heat spreader. If the IC weighs 20g with heat spreader, this would mean, that one of those ICs yields more than half a gram. Even if it weighs 10g this would be equal to the best ceramic CPUs, calculated per piece.

Time to do a reality check, either the numbers are wrong or your math... hint, check your math! :mrgreen: 0.279% of 20g is 0.056g and if the weight is the same as the one above then it is closer to 10 grams with 0.028g Au.

Göran

Seems that my math was wrong by a factor of 10. 0,028g makes more sense than 0,2g, which, as I said, I couldn't believe. Thanks for correction, Göran.

@Necromancer
Waited so long for finally finding one mistake? Is that your face value?

The wise one knows, he knows nothing. Lao Tse

 

[Anonymous]

Bjorn.

Don't worry, I wouldn't bother about the nit picking.

Jon

 

[solar_plasma]

Thanks, Jon.

I don't bother, it was more meant as a stimulus for self reflection. I would rather get on well again with necro and it is a pity that an old misunderstanding is inhibiting this.

I love this special culture of the forum, refiners helping refiners, much more a society of upright, honorable, not always easy personalities (myself included). And that is, what I see in all of you: Upright and honorable individuals bonded together by a shared knowledge, a shared way to do things and a shared way to look at things.