Dear all,
as this is my first post I want to thank you for this great forum and your efforts sharing this overwhelming informations. My apologies for my english. It is not my native language. I'm located in Germany.
I signed in months ago, try to read and learn as time allows. I started with first little experiments and I'm afraid I have to come back with questions at given points.
Nevertheless I want to share my data as a marginal contribution to this forum. I noticed there are very different data on PM content of IC's in plastic packages.
Last year I got back results a batch of BGA Chips I gave to a professional refiner. Please see picture and the result. Batch was pure not mixed with other IC's.
Chips are squarish with 6x6 mm edge length. 1 chip has a weight of 0.06 g.
On the picture you can see that every chip has 64 so called solder balls.
Although data of refiner are in german I think they are easy to understand.
Original batch weight was 24 kg. After inciniration 18.1 kg material left.
Contents of material left: Gold 1.146 %, Silver 0.715 %.
Assaying and refinig cost were 399 EUR. Refiner pays me 98% of gold and 72 % of silver.
I have similar data with a second batch. So data given are obtained from 100 kg of refined IC's.
This kind of IC's are to be find in e.g. cell phones. Doing the power management, audio and camera funcions. Picture shows IC's build in Motorola ZN5.
Summarized data on BGA Chips with 64 solder balls in a 6x6mm package:
Organic content: 25%
Au content: 0.865 %
Ag content: 0.539 %
Refining costs: 20 Euro/kg
Perhaps there is someone who can use this data for estimation of PM contents of similar chips.
Thank you for this great forum.
as this is my first post I want to thank you for this great forum and your efforts sharing this overwhelming informations. My apologies for my english. It is not my native language. I'm located in Germany.
I signed in months ago, try to read and learn as time allows. I started with first little experiments and I'm afraid I have to come back with questions at given points.
Nevertheless I want to share my data as a marginal contribution to this forum. I noticed there are very different data on PM content of IC's in plastic packages.
Last year I got back results a batch of BGA Chips I gave to a professional refiner. Please see picture and the result. Batch was pure not mixed with other IC's.
Chips are squarish with 6x6 mm edge length. 1 chip has a weight of 0.06 g.
On the picture you can see that every chip has 64 so called solder balls.
Although data of refiner are in german I think they are easy to understand.
Original batch weight was 24 kg. After inciniration 18.1 kg material left.
Contents of material left: Gold 1.146 %, Silver 0.715 %.
Assaying and refinig cost were 399 EUR. Refiner pays me 98% of gold and 72 % of silver.
I have similar data with a second batch. So data given are obtained from 100 kg of refined IC's.
This kind of IC's are to be find in e.g. cell phones. Doing the power management, audio and camera funcions. Picture shows IC's build in Motorola ZN5.
Summarized data on BGA Chips with 64 solder balls in a 6x6mm package:
Organic content: 25%
Au content: 0.865 %
Ag content: 0.539 %
Refining costs: 20 Euro/kg
Perhaps there is someone who can use this data for estimation of PM contents of similar chips.
Thank you for this great forum.