Then I removed the heat spreaders.
After three CPUs, I stopped taking the heat spreaders off, since I didn’t know if I was burning off some of the gold, or if it was absorbing further into the heat spreader. I continued to process only three CPUs at this point.
A word of caution, cardboard can burn when hot heat spreaders fall onto it. I would recommend using something not flammable but that can be easily emptied into the reaction container. As a side note, it appears that the bonding wires are aluminum as shown in the next photograph.
Not sure if all of the Pentium Pros have aluminum bonding wires, but at least two that I examined, did. Before I added HCL and sodium nitrate, I smashed the silicon chip to allow for more complete access to the gold brazing. The following picture has the CPUs ready for action.
Using HCL and sodium nitrate, I heated and allowed to react for about one and a half hours. In a separate container, I added HCL and sodium nitrate to the black covers and heat spreaders, heated and allowed to react for approximately 1.5 hours. Following the completion of the reaction, it appeared all of the gold had been removed from the CPU’s.
I combined the two solutions, and precipitated with SMB. The results of the test indicated that I yielded about 0.37 grams per CPU, and I only processed one time. I am hoping to run another batch following this same method to find out if the process actually makes a difference.
The results could just be that I was getting better at processing them, hard to say. Also, I have not processed the towel with the thermal compound, since I would need a bit more to experiment with. Any ideas on how to separate thermal paste from potential gold?