eagle2
Well-known member
P_Carrol. Earlier in this thread I reported an exeriment with a Silver plated butter dish. The solution was tap water, CuSO4, H2O2, and a small amount of H2SO4. After a few days The plating was very loose or had disintigrated. some scraping work was necessary to get it all off. The solution attacks the copper base and the Silver does not go into solution.
With steel base nuts you may have a different result.
THIS process everybody is disscussing is nothing but a Copper leach, similiar to the AP process (with HCl).
The difference is that Copper does not form a Cuprous Sulfate (in the AP process it forms Cuprous Chloride which is not very soluble and quickly slows the leaching reaction).
Copper Sulfate (Cu II, should be called Cupric Sulfate) is reduced in the reaction to Cu I. Then it forms a Sulfite or an Oxide. This is Cuprous Sulfite (Cu2SO3), which has several varying compound forms, red to pale yellow to white in color, or Cuprous Oxide (Cu2O) (color may be yellow, red or brown). Cuprous Oxide breaks down in dilute H2SO4 to Cupric Oxide (CuO) and elemental Copper.
Also in the sludge at the bottom is Elemental Sulfur, salts and the PM`s broken down to fines or whole bits of foils. The presence of Sulfur indicates that the Sulfate ion also enters the reactions going on(Probably reacting with the H2O2 or O2 in solution).
I am still experimenting with small batches and will report more later.
I like it so far, because the solution stays cleaner and needs less attention than AP with HCl. Also Iam not using any heat. Also the constant formation of bubbles forms a mechanical action that seems to easily break the foils and leach the base metals to a greater extent, than AP with HCl.
You can Google Copper Sulfate leach and get a ton of info to study.
Al
With steel base nuts you may have a different result.
THIS process everybody is disscussing is nothing but a Copper leach, similiar to the AP process (with HCl).
The difference is that Copper does not form a Cuprous Sulfate (in the AP process it forms Cuprous Chloride which is not very soluble and quickly slows the leaching reaction).
Copper Sulfate (Cu II, should be called Cupric Sulfate) is reduced in the reaction to Cu I. Then it forms a Sulfite or an Oxide. This is Cuprous Sulfite (Cu2SO3), which has several varying compound forms, red to pale yellow to white in color, or Cuprous Oxide (Cu2O) (color may be yellow, red or brown). Cuprous Oxide breaks down in dilute H2SO4 to Cupric Oxide (CuO) and elemental Copper.
Also in the sludge at the bottom is Elemental Sulfur, salts and the PM`s broken down to fines or whole bits of foils. The presence of Sulfur indicates that the Sulfate ion also enters the reactions going on(Probably reacting with the H2O2 or O2 in solution).
I am still experimenting with small batches and will report more later.
I like it so far, because the solution stays cleaner and needs less attention than AP with HCl. Also Iam not using any heat. Also the constant formation of bubbles forms a mechanical action that seems to easily break the foils and leach the base metals to a greater extent, than AP with HCl.
You can Google Copper Sulfate leach and get a ton of info to study.
Al