Search results for query: ap

...and selling it all as is. Different materials require different processes. The gold from some plated materials can be recovered by the AP process, then refined. Other plated materials, like pins, are better processed in a sulfuric stripping cell. Ceramic ICs can be broken into pieces then...

A tip: try to get a feeling for the different thicknesses of gold plating by rubbing it off with a pen eraser. And AP can be reused forever. It just increses until you have too much. It's never really waste. I get the feeling you make new AP for each batch. You don't have to.

...pins. the acid peroxide method then hcl and bleach. let me clarify a little , I work in the field for a month, during that time the pins are in AP, when I come on vacation for a couple of days, I filter, collect foils and then hcl and bleach. It's just my hobby, I have my main job. Don't be...

I would not use Nitric on PCB's, but AP. When making AR, cover the pieces in HCL, heat it to 80C and add drops of nitric at a time. keep the beaker loosely covered to recycle the NO2 gas back in HNO3. Only add more once all reaction has stopped. When you're more experienced, you can add more...

...gold into solution. You basically don't need any extra oxidizer to dissolve your Copper. Copper and Nickel do not react with HCl so nothing will happen at first. But your solution will start absorbing oxygen from the air (which it would get from the H2O2) and oxidizing the copper to copper...

...during processing - this is huge thing if you will scale up sometime and want to save time by doing bigger mixed batches of all kinds of scrap. 4L HCl + 1-1,2L nitric for kilo of copper based scrap. For ferrous based less nitric and more HCl. Adjust from case to case, this is only empirical...

Well, yes and no. If all you ever dissolve is copper, AP can be reused indefinitely. The problem comes when other metals are introduced to the mix. For example, if it is used to dissolve pins, the base metal will be brass or some other mix like kovar. Using brass as the example, the zinc...

No, used the same peroxide as I always have. The tin I bought to make stannous I think was something else. I've made multiple batches and the tin never dissolves, just sits there.

The copper from the AP will be precipitated out if there are any basemetal ic legs. In time all base metals will dissolve again. The tin from the solder will form stannous chloride and react with any Pd if present in th AP, but other than that a little solder won't hurt much i think. But...

That is really the best answer I could ask for. Simple and straightforward. Nitric for the win!!

I find AP pretty forgiving. Just use one labeled vessel for dissolving solder. Then move them once the solders gone. I have a few 1.5 gallon buckets with lids that have been going for better than a year now. Once you’ve got the cycle down it’s just a matter of moving things every now and...

...if involved in the leaching process of the gold foils, tin will dissolve into the cupric chloride leach solution (what you are referring to as AP solution), making stannous chloride as one of the metal chloride salts dissolved in this solution of mainly copper chlorides. If you use the...

...gold-over-nickel ceramic dual inline package IC's. These also have interior gold bond wires. They look like this And have a gold-over-nickel cap on top. (I pulled the ancient MSDS / Package drawing to figure out the base metal. ) Now - I have read post after post about "cooking" the...

I am certain that a detectable amount of gold is in that flask. I produced a fair amount of gold flakes/foils (from the AP process) before dissolving them in the Shor AR solution. Also, I failed to mention that the stannous test also had a trace of "white or silver" in addition to the dark brown...

Yes and yes. Thank you. Thank you. What do you mean by a line? I understand now - it will be an outdoor set up. I have plenty of copper - what is the best way to corrode copper? Yes, there are many options with this set up, but I will start simple and leave it outside for 1 - 2 weeks. Good...

...bucket contains foils it’s easy enough to filter them and rinse before adding to another batch. I don’t recover and refine in one batch. Rather a series that ends up where it needs to be. One of the quarks of using AP to liberate the values. Remove the foils with AP, rinse, then refine.

I no longer use air hose for “AP”. When I did, regular aquarium hose worked fine as I replaced it about once a year anyway. From there I started using cpvc water line and five gallon buckets. When I do use “AP” now I use air lift type pumps to circulate the solution. The biggest downside to this...

If we place fingers in CuCl2 (AP) it eats the copper out from under the gold layer. If enough oxygen is introduced it starts working on the other metals, gold on the fingers. It will cement the gold back out and and leave this as powders in the solution along with the foils. Excess oxidizer will...

I did rinse the sediment 2 times to clear before roasting it. I have 3 specific boards that AR didn't touch & no other metals remain. The 3 boards seem to be coated with a epoxy of sorts. I saved it to do later. I won a bid on eBay over 600g of assorted materials at 55.00 for this Test. I...

...AR. You can use HCl and either bleach or hydrogen peroxide to dissolve the gold. Melting along with the impurities will leave you with impure gold. CuCl2 (aka AP) would be a better choice than the piranha (sulfuric and peroxide) solution to dissolve the base metals under the gold plating...

...onto the Copper traces inside the ram sticks, CPUs and so on. This kind of material is not considered foils until after you have run it through an AP cycle so it is ONLY foils. Negative Stannous here means either no Gold dissolved or the Gold dissolved and plated back. What about our other...

...too much H2O2 will dissolve some gold. You don't need it. HCl does not dissolve copper but it does dissolve copper oxide or copper carbonate rapidly into the copper chloride you want. Add a bubbler and it will take off without any peroxide. The Name Acid Peroxide is actually misleading...

Thanks Thanks Martijn, There are 5 flat pak chips on each, about 1cm square. Surface mount so not much solder. AP should be fine. Just need a bigger bucket or use fewer per batch I guess….

...I am confident that things wont blow up in my face ... Just did a quick research and it does turn out that 30% HCL is easily available in Germany (no idea where I picked up the notion that it was not) ... Will look into the AP process then ... Thanks all for your help, much appreciated...

To make AP without H2O2: let some copper oxidize by keeping it moist every now and then. Or look for copper with a green layer of oxide. Like a copper busbar rig hanging in the fume hood over an AP bucket for a couple years.. Put the copper (without rust and other trash) in HCl to soak the...

...not do much more than dissolve some aluminum and other similar metals (Strong Peroxide). The Copper is easily attacked by Nitric or a Copper Chloride etch (AP), not so quickly though. I think the consensus here on the forum is to gravity separate the bonding wires, this will create much less...

...Jr, Ramon: Ruiz Jr, Ramon One part of ram is okay,simply pulling out ic chips, next is your method, I thought of AR but you make the best move " AP which is HCL and hydrogen peroxide combo " okay getting through it, refining goes neat. pyrolize hmm okay mate with this idea fume hood is...

Add a few drops of Sulfuric, that will take care of it.

I tried with pressurized bottle, it seems like static holds them, even the glass pipete I used to stirr has gold, will alcohol or soap affect anything? Soap will break the surface tension and should make everything sink?

Too big for AP, you need to either make shots or roll it thin and cut it in thin strips. Or go straight to AR.