I agree with FrugalRefiner here.
When using copper II chloride, adding too much oxidizer will become a problem, it is the copper II chloride that we are dissolving copper with (not the oxidizer, and the acid).
We may need to add HCl acid, and air (or a little 3% H2O2) to rejuvenate the copper II chloride as it becomes more of a copper I chloride solution, but these are not added to speed the reaction, or to make it dissolve copper faster...
Note: it is not HCl or H2O2 That we use to dissolve copper, these are used with copper to make copper II chloride.
It is actually the copper II chloride that we use to dissolve more copper.
We just add more acid or oxidizer as needed to keep the copper II chloride in a healthy state, so that will dissolve more copper, using the acid or oxidizer to convert CuCl back into CuCl2...
Thin copper does not take too long to dissolve in this solution, but if the copper is thicker like with pins it will take longer, that is the nature of it, trying to speed it up with more acid or adding too much H2O2, will do more harm than good.
Temperature (within reason) can help some, to speed it up somewhat, or slow it down if the weather is too cold, but even this has to be done within reason, as it can be a double edge sword, some heat will help the reactions, but can also set up another set of problems.
Studying the documents on the copper II chloride leach found on Laser Steve's web site will help you get a better understanding of how this leach (or copper etching solution) works, and studying the forum will also help as it has been discussed in great depth.