That was the reason why I asked if you have read the threads that was recommended.Thanks so much for your apology. I truly didn't mean to be confusing in any way. But I did go back and read all of them again and found how my lack of detailed communication was misleading and I apologize as well. I'm just so frustrated with process. I've been hesitant to perform this process and gold recovery from IC chips because of the extra hassle of incinerate and/or pyrolizing. So I just collected and collected my horde of icy chips and figured I would go with the simplest which I thought was the simplest which were these IC chips with no legs or metal to speak of. Except for the solder balls of course. I've read everything I can. And thought I had this in hand. But alas I do not and all this tedious extra steps are frustrating enough let alone drying it and doing it all over again! ( In which I do it right this time, or at least thorough!)
So now as it stands. I have my material drying and awaiting pyrolyzation. Any advice on what to do from this point on? I showed the container I plan to use for pyrolyzation. So I guess until then nothing needs to be done?
You have at least been skipping some important threads from your own research.
Pyrolizing is the first thing you do before any incineration so the volatile gases can be burnt off.
And you will find drawings of pyrolizing vessels. The simplest is just a tin can with some holes in the upper part.
For incineration an open wide container is best so it has good access to air and stirring. Frying pan may be used.
So now you will incinerate the powder in a wide open container.